| PCB stack-up | 1-20 Layer |
| Max. board thickness | 125.98mil (3.20mm) |
| Min. board thickness (ML) | 12 mil (0.3mm) |
| Min. board thickness (DL) | 8mil (0.2mm) |
| Min. Inner layer thickness | 2mil |
| Max. WPNL Size | 550mmX 450mm |
| Inner layer copper thickness | 0.3 oz~5.0 oz |
| Outer layer copper thickness | 0.3 oz~4.0oz |
| Minimum drill hole size | 6mil (0.15mm) |
| Max. width rate | 1:8 |
| Thickness error control | ± 10% |
| Circuit width / spacing in outer layer | 3/3 mil |
| Circuit width / spacing in inner layer | 3/3 mil |
| Pitch limited SMT spacing | 8mil (0.2 mm) |
| Pitch limited BGA spacing | 6 mil (0.15 mm) |
| Limited solder mask print width | 3 mil (0.075 mm) |
| Solder positioning and accuracy control | ± 2 mil |
| Impedance control | Ω ± 10% |
| Layer registration tolerance control | ± 6mil (0.15mm) |
| Board warpage control | ± 0.7% |
| Pattern to Board edge (T<= 1.6mm) |
CNC 6mil V-Cut 15mil |