| 層數 PCB stack-up |
1-20 Layer |
| 最大板厚 Max. board thickness |
125.98mil (3.20mm) |
| 最小板厚(多層板) Min. board thickness (ML) |
12 mil (0.3mm) |
| 最小板厚(雙面板) Min. board thickness (DL) |
8mil (0.2mm) |
| 最小內層板厚 Min. Inner layer thickness |
2mil |
| 最大工作板尺寸 Max. WPNL Size |
550mmX 450mm |
| 內層銅厚 Inner layer copper thickness |
0.3 oz~5.0 oz |
| 外層銅厚 Outer layer copper thickness |
0.3 oz~4.0oz |
| 最小鉆孔孔徑 Minimum drill hole size |
6mil (0.15mm) |
| 最大縱橫比 Max. width rate |
1:8 |
| 板厚誤差控制 Thickness error control |
± 10% |
| 外層線路之線寬 / 距 Circuit width / spacing in outer layer |
3/3 mil |
| 內層線路之線寬 / 距 Circuit width / spacing in inner layer |
3/3 mil |
| 最小SMT焊墊間距 Pitch limited SMT spacing |
8mil (0.2 mm) |
| 最小 BGA焊墊間距 Pitch limited BGA spacing |
6 mil (0.15 mm) |
| 最小防焊印刷寬度 Limited solder mask print width |
3 mil (0.075 mm) |
| 防焊對位誤差控制 Solder positioning and accuracy control |
± 2 mil |
| 阻抗控制 Impedance control |
Ω ± 10% |
| 層間對位誤差控制 Layer registration tolerance control |
± 6mil (0.15mm) |
| 板彎翹(曲) Board warpage control |
± 0.7% |
| 成型邊內縮距離 Pattern to Board edge (T<= 1.6mm) |
CNC 6mil V-Cut 15mil |